Creep-Fatigue Properties of Sn-37Pb Solder Material Evaluated by Room Temperature Testing under Various Strain Waveforms-Reference-Cited by-同舟云学术

Creep-Fatigue Properties of Sn-37Pb Solder Material Evaluated by Room Temperature Testing under Various Strain Waveforms

Published:2004 Issue:3 Volume:47 Page:380-388
ISSN:1344-7912
Container-title:JSME International Journal Series A
language:en
Short-container-title:JSME Int. J., Ser. A

Author:

TOKIMASA Katsuyuki¹

Affiliation:

1. Department of Mechanical Engineering and Biomimetics, Kinki University

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,General Materials Science

Link

http://www.jstage.jst.go.jp/article/jsmea/47/3/47_3_380/_pdf

Reference16 articles.

1. (1) Manson, S.S., Halford, G.R. and Hirschberg, M.H., Creep-Fatigue Analysis by Strain-Range Partitioning, First Symposium on Design for Elevated Temperature Environment, (1971), pp.12-28, ASME.

2. A New High Temperature Creep-Fatigue Damage Rule.

3. A new high-temperature creep-fatigue damage rule based on the strain range partitioning concept

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