Applicability of Fracture Mechanics on Brittle Delamination of Nanoscale Film Edge
Author:
Affiliation:
1. Department of Engineering Physics and Mechanics, Kyoto University
2. Graduate School of Informatics, Kyoto University
Publisher
Japan Society of Mechanical Engineers
Subject
Mechanical Engineering,General Materials Science
Link
http://www.jstage.jst.go.jp/article/jsmea/47/2/47_2_106/_pdf
Reference17 articles.
1. Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading
2. Crack initiation at free edge of interface between thin films in advanced LSI
3. A Stress Singularity Parameter Approach for Evaluating the Interfacial Reliability of Plastic Encapsulated LSI Devices
4. Effect of residual stress on delamination from interface edge between nano-films
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