A Stress Singularity Parameter Approach for Evaluating the Interfacial Reliability of Plastic Encapsulated LSI Devices

Abstract

Since the stress and displacement fields near a bonding edge show singularity behaviors, the adhesive strength evaluation method, using maximum stresses calculated by a numerical stress analysis such as the finite element method, is generally not valid. In this paper, a new method, which uses two stress singularity parameters, is presented for evaluating adhesive strength. This method is applied to several kinds of molded models, composed of epoxy base resin and Fe-Ni alloy sheets, and plastic encapsulated LSI models. Predictions about the initiation and extension of delamination are compared with the results of observations made by scanning acoustic tomography on these models.