Failure Analysis and Stress Evaluation of Maleimide Molding Films during Temperature Cycling
Author:
Affiliation:
1. Faculty of Engineering, Fukuoka University
2. R&D Division, Lintec Corporation
Publisher
Japan Institute of Electronics Packaging
Link
https://www.jstage.jst.go.jp/article/jiepeng/14/0/14_E21-005-1/_pdf
Reference24 articles.
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4. [4] A. Ostmann, L. Boettcher, D. Manessis, S. Karaszkiewicz, and K.-D. Lang, "Power modules with embedded components," 2013 Eurpoean Microelectronics Packaging Conference (EMPC), pp. 1–4, 2013.
5. [5] T. Loher, S. Karaszkiewicz, L. Bottcher, and A. Ostmann, "Compact power electronic modules realized by PCB embedding technology," 2016 IEEE CPMT Symposium Japan (ICSJ), pp. 259–262, 2016.
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