Simulation on the Interfacial Singular Stress-strain Induced Cracking of Microelectronic Chip Under pPower On-off Cycles
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Published:2019-09-23
Issue:
Volume:
Page:69-78
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ISSN:2232-6979
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Container-title:Informacije MIDEM - Journal of Microelectronics, Electronic Components and Materials
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language:en
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Short-container-title:Informacije MIDEM
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials