Creep-Fatigue Crack Growth in Sn-3.0Ag-0.5Cu Solder-Reference-Cited by-同舟云学术

Creep-Fatigue Crack Growth in Sn-3.0Ag-0.5Cu Solder

Published:2010 Issue:9 Volume:4 Page:1410-1426
ISSN:1880-9871
Container-title:Journal of Solid Mechanics and Materials Engineering
language:en
Short-container-title:JMMP

Author:

WOO Tae Wuk¹,SAKANE Masao²,KIM Kwang Soo¹,KOBAYASHI Kaoru³,PARK Hyun Chul¹

Affiliation:

1. Department of Mechanical Engineering, Pohang University of Science and Technology

2. Department of Mechanical Engineering, Faculty of Science and Engineering, Ritsumeikan University

3. Advanced Packaging Laboratory, Kyocera SLC Technologies Corporation

Publisher

Japan Society of Mechanical Engineers

Link

http://www.jstage.jst.go.jp/article/jmmp/4/9/4_9_1410/_pdf

Reference44 articles.

1. Solder Creep-Fatigue Interactions With Flexible Leaded Parts

2. Fatigue crack propagation life analysis of solder joints under thermal cyclic loading

3. Fatigue crack-growth behavior of Sn-Ag-Cu and Sn-Ag-Cu-Bi lead-free solders

4. Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

5. (5) Zhao, J., Miyashita, Y. and Mutoh, Y., Fatigue crack growth behavior of 96.5Sn-3.5Ag lead-free solder, International Journal of Fatigue, Vol.23 (2001), pp.723-731.

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