1. C.A. Harper, Electronic Packaging and Interconnection Handbook, Chap. 5, 4th edn. (New York: McGraw-Hill) pp. 5–74.
2. H.D. Solomon, Life Prediction and Accelerated Testing. The Mechanics of Solder Alloy Interconnects, ed. D.R. Fear, S.N. Burchett, H.S. Morgen, and J.H. Lau (New York: Van Nostrand Reinhold, 1994), p. 199.
3. W.A. Logsdon, P.K. Liaw, and M.A. Burke, Eng. Fract. Mech. 36, 183–218 (1990).
4. J. Zhao, Y. Miyashita, and Y. Mutoh, Int. J. Fatigue 23, 723 (2001).
5. C. Kanchanomai and Y. Mutoh, Int. J. Mech. Mater. Eng. 2, 1318 (2008).