Resin Self-Alignment Processes for Self-Assembly Systems
Author:
Kim Jong-Min1, Yasuda Kiyokazu1, Fujimoto Kozo1
Affiliation:
1. Department of Manufacturing Science, Graduate School of Engineering, Osaka University, 2-1 Yamada-Oka, Suita, Osaka 565-0871, Japan
Abstract
We have demonstrated the self-alignment processes using surface tension of the resin material for the self-assembly systems. It has been known that the surface tension of the resin material is too low to achieve the self-alignment capability. This paper presents a fundamental concept and principles of resin self-alignment processes. The numerical analysis is conducted to enhance understandings of resin self-alignment behavior and the relationship between process-related parameters. It was proved that resin self-alignment is different from the oscillatory motion of solder self-alignment and shows overdamped motion by the experiment. We could achieve the precise alignment of less than 0.4 μm.
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference23 articles.
1. Romig, Jr, A. D., Dugger, M. T., and McWhorter, P. J., 2003, “Materials Issues in Microelectromechanical Devices: Science, Engineering, Manufacturability and Reliability,” Acta Mater., 51, pp. 5837–5866. 2. Oh, K. W., Ahn, C. H., and Roenker, K. P., 1999, “Flip-Chip Packaging Using Micro-machined Conductive Polymer Bumps and Alignment Pedestals for MOEMS,” IEEE J. Sel. Top. Quantum Electron., 5(1), pp. 119–126. 3. Prather, D. W., Venkataraman, S., Lecompte, M., Kiamilev, F., Mait, J. N., and Simonis, G. J., 2001, “Optoelectronic Multichip Module Integration for Chip Level Optical Interconnects,” IEEE Photonics Technol. Lett., 13(10), pp. 1112–1114. 4. Holm, J., A˚hlfeldt, H., Svensson, M., and Vieider, C., 2000, “Through-Etched Silicon Carriers for Passive Alignment of Optical Fibers to Surface-Active Optoelectronic Components,” Sens. Actuators, A, 82(1-3), pp. 245–248. 5. Linderman, R. J., and Bright, V. M., 2001, “Nanometer Precision Positioning Robots Utilizing Optimized Scratch Drive Actuators,” Sens. Actuators, A, 91(3), pp. 292–300.
Cited by
15 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
|
|