Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration-Reference-Cited by-同舟云学术

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Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration

Published:2016-02 Issue:1 Volume:25 Page:91-100
ISSN:1057-7157
Container-title:Journal of Microelectromechanical Systems
language:
Short-container-title:J. Microelectromech. Syst.

Author:

Ito Yuka,Fukushima Takafumi,Kino Hisashi,Lee Kang-Wook,Tanaka Tetsu,Koyanagi Mitsumasa

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

http://xplorestaging.ieee.org/ielx7/84/7396981/7317718.pdf?arnumber=7317718

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Bendability Enhancement and Miniaturization of Through-X Via (TXV) Based on Flexible FOWLP with Tiny Cu Pillar Assembly;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Integration And Process Challenges Of Self Assembly Applied To Die-To-Wafer Hybrid Bonding;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. Surface Tension-Based Alignment of Microfibers on Hydrophilic–Superhydrophobic Grooved Surfaces;Micromachines;2020-10-29

5. Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly;2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2020-04

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