Influence of Selected Design Variables on Thermo-Mechanical Stress Distributions in Plated-Through-Hole Structures
Author:
Affiliation:
1. CALCE Center for Electronics Packaging, University of Maryland, College Park, MD 20742
2. CALCE Center for Electronics Packaging, Engelmaier Associates, Inc., Mendham, NJ 07945
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/114/1/8/5580622/8_1.pdf
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