Stress-Strain Model in Plated Through-Holes of Multilayer Printed Circuit Boards
Author:
Affiliation:
1. Tianjin Aerospace Reliability Technology Co., Ltd,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10493201/10493208/10493653.pdf?arnumber=10493653
Reference15 articles.
1. Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards;Engelmaier,1988
2. A Simple Model for the Thermo-Mechanical Deformations of Plated-Through-Holes in Multilayer Printed Wiring Boards
3. Thermally Induced Strain in Plated-Through-Holes in Multilayer Circuit Boards;Nankey,1976
4. Results of IPC Copper Foil Ductility Round Robin Study,1986
5. A PTH reliability model considering barrel stress distributions and multiple PTHs in a PWB;Xie,2006
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