Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model-Reference-Cited by-同舟云学术

Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model

Published:2011-12-01 Issue:4 Volume:133 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Han Wei¹,Rensing Marc¹,O’Brien Peter¹,Peters Frank H.²

Affiliation:

1. Integrated Photonics Group, Tyndall National Institute, Cork, Ireland

2. Integrated Photonics Group, Tyndall National Institute, Cork, Ireland; Department of Physics, University College Cork, Cork, Ireland

Abstract

In this paper, the packaging aspects of directly modulated laser (DML) modules are investigated using detailed electromagnetic (EM) simulations. The packaging influences of the laser module are specified in two parts as RF connector and optoelectronic subsystem. By carefully optimizing the package structure, the simulation results show that the insertion loss of the proposed module is less than 1 dB up to 40 GHz. Then, a DML module is packaged and measured based on the optimized package scheme. A resonance free bandwidth of approximately 20 GHz is obtained with a 3 dB bandwidth of about 15 GHz.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4005292/5885015/044502_1.pdf

Reference5 articles.

1. Characterization of Parasitics From Scattering Parameters of Laser Diode;Zhang;Microwave Opt. Technol. Lett.

2. Characterization of Parasitics in TO-Packaged High-Speed Laser Modules;Chen;IEEE Trans. Adv. Packag.

3. Analysis of Substrates for Single Emitter Laser Diodes;Alander;ASME J. Electron. Packag.

4. Transient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing;Ting;ASME J. Electron. Packag.

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