Transient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing

Author:

Ting Ben12,Manno Vincent P.32

Affiliation:

1. Student Mem. ASME

2. Department of Mechanical Engineering, Tufts University, Medford, MA 02155

3. ASME Fellow

Abstract

Laser hammering (LH) is a process used in the manufacturing of butterfly optoelectronic packages to correct laser-to-fiber misalignment that occurs when the semiconductor lasers are welded in place. High-power, precisely positioned pulsed lasers are used in LH to induce deformation of the fiber support housing to, in turn, induce realignment. A thermomechanical modeling study of LH is reported in this paper, which focuses on the degree to which a steady-state model can predict the asymptotic state of a transient response subjected to a periodic laser excitation. A baseline, two-dimensional fiber mounting/ferrule geometry is employed in a finite element analysis simulation case study. Various laser wave forms are applied to focus spot location sizes of 50 and 200μm over a range of applied heat fluxes (10-1000W∕mm2). Effects of laser energy deposition location, as well as the use of multiple lasers, are also studied. The results show that the steady-state solution is in good agreement with the asymptotic transient response for horizontal fiber displacement and fiber temperature. The laser focus spot surface temperature predictions are also found to be in reasonable agreement. However, the vertical fiber displacement tends to be overpredicted by the steady-state solution, sometimes by as much as an order of magnitude. The causes, both physical and computational, of this disagreement are discussed.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. Automated Mass Production Line for Optical Module Using Passive Alignment Technique;Yamauchi

2. Jablonski, D. , 2000, “Laser Welding Familiarization Module,” Tufts Thermal Manufacturing Workshop, Tufts University, http://ase.tufts.edu/mechanical/thermal/infopages/Program2000.htm

3. Fabrication of Semiconductor Optical Switch Module Using Laser Welding Technique;Kang;IEEE Trans. Adv. Packag.

4. Laser Weldability Analysis of High-Speed Optical Transmission Device Packaging;Song;IEEE Trans. Compon., Packag. Manuf. Technol., Part B

5. Laser Welding Induced Alignment Distortion in Butterfly Laser Module Packages: Effect of Welding Sequence;Lin;IEEE Trans. Adv. Packag.

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Advanced Packaging of Optoelectronic Devices;Wiley Encyclopedia of Electrical and Electronics Engineering;2013-01-18

2. Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model;Journal of Electronic Packaging;2011-12-01

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