Affiliation:
1. Digital Equipment Corporation, 146 Main Street, Maynard, MA 01754
Abstract
A new test to measure the adhesion of thin polymeric coatings (the so-called “edge delamination test”) has been recently proposed by Shaffer et al. (1993), where the authors translate the test measurements into the values of the debond energy by finite element modeling. The present paper suggests another interpretation of the mechanics of the edge delamination test and translates the measurements of this test into conventional values of the adhesion strength—the ultimate peeling stress, using a simple closed-form solution.
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
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K. L.
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4. Shaffer II, E. O., McGarry, F. J., and Trusell, F., 1993, “Edge Delamination Testing: A Method for Measuring the Adhesion of Thin-Film Coatings in Microelectronic Applications,” MRS, Spring Annual Meeting.
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2 articles.
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