Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints-Reference-Cited by-同舟云学术

Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints

Published:1997-12-01 Issue:4 Volume:119 Page:218-227
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Heinrich S. M.¹,Shakya S.¹,Lee P. S.²

Affiliation:

1. Department of Civil and Environmental Engineering, Marquette University, P. O. Box 1881, Milwaukee, WI 53201-1881

2. Rockwell Automation, 1201 South Second Street, Milwaukee, WI 53204

Abstract

An analytical expression is derived for determining the maximum solder joint shearing displacement occurring in an a real-array interconnect under global CTE mismatch loading. The result may be viewed as a “load correction factor” to be applied to the commonly used estimate which is based on the free thermal expansion of component and substrate. The new expression for the correction factor includes the following parameters: (a) dimensions and material properties of component and substrate; (b) array size and population; (c) material properties of solder; and (d) geometric parameters of the individual joints. The theoretical result is based on modeling the assembly as two circular elastic disks connected by a shear-type “elastic foundation” whose distributed shear stiffness is related to the joint/array characteristics. The analytical expression and the graphical aids presented herein may provide convenient alternatives to performing time-consuming and expensive finite element “macro-analyses” on the assembly for the purpose of specifying boundary conditions for a subsequent “micro-analysis” on a single joint.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/119/4/218/5513372/218_1.pdf

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