Author:
Shaffer Edward O.,Mcgarry Frederick J.,Trusell Fred
Abstract
ABSTRACTWe propose a new test to measure the adhesion of thin polymeric coatings used in microelectronic applications. Similar to previous tests [1-3], the edge delamination test (EDT) takes advantage of the thermal residual stress present in the coating to induce delamination. However, in the EDT, we take advantage of lithography to fabricate test geometries that probe a complete range of debond energies. As a result, nearly a hundred adhesion tests can be performed on a single wafer. In this report, we apply finite element analysis to assess the debond energy generated at the coating/substrate interface to determine the feasibility of the test. The analysis also quantifies the effect of various geometries and boundary conditions. We apply the EDT to study the adhesion of Cyclotene™ 3022 polymer to silicon coated with evaporated aluminum. The critical mode I strain energy release rate for the Cyclotene/Aluminum interface with no adhesion promoter is 10.5±0.2 J/m2.
Publisher
Springer Science and Business Media LLC
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