A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages-Reference-Cited by-同舟云学术

A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages

Published:2006-02-10 Issue:4 Volume:128 Page:305-310
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Tonapi Sandeep S.¹,Sathe Sanjeev B.²,Sammakia Bahgat G.³,Srihari K.³

Affiliation:

1. GE Global Research Center, Niskayuna, New York 12309

2. Advanced Semiconductor Engineering, Santa Clara, California 95054

3. Thomas J. Watson School of Engineering and Applied Science, State University of New York at Binghamton, Binghamton, New York 13902-6000

Abstract

This paper presents the results of a comprehensive numerical study of the thermal performance of Tape Ball Grid Array package mounted on one side of a printed circuit board as well as packages mounted in back-to-back and offset configurations. A cover plate is attached to the back side of the chips to enhance heat transfer from the module. The assembled organic carrier is placed in a vertical channel. A conjugate heat transfer model is used which accounts for conduction in the packages and the card and convection in the surrounding air. The effect of location of the modules on a card with zero, one and two power planes is evaluated for thermal performance. Heat dissipation is studied for forced convection (2, 1, and 0.5m∕s). Comparison is made for single sided and back-to-back cases.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/128/4/305/5632931/305_1.pdf

Reference14 articles.

1. An Assessment of the Thermal Performance of the PBGA Family;Mulgaonker;IEEE Trans. Compon., Packag. Manuf. Technol., Part A

2. Analysis of a Thermally Enhanced Ball Grid Array Package;Guenin;IEEE Trans. Compon., Packag. Manuf. Technol., Part A

3. Modeling and Measurements of Heatspreader Thermal Performance in Molded Plastic Packages;Chyu

4. Natural Convection Liquid Cooling of a Substrate Mounted Protrusion in a Square Enclosure: A Parametric Study;Sathe;ASME J. Heat Transfer

5. Computations of Liquid Immersion Cooling for a Protruding Heat Source in a Cubical Enclosure;Wroblewski;Int. J. Heat Mass Transfer