Analysis of a thermally enhanced ball grid array package-Reference-Cited by-同舟云学术

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Analysis of a thermally enhanced ball grid array package

Published:1995 Issue:4 Volume:18 Page:749-757
ISSN:1070-9886
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. A

Author:

Guenin B.M.,Marrs R.C.,Molnar R.J.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/95/10163/00477460.pdf?arnumber=477460

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