Author:
Wroblewsk Donald E.,Joshi Yogendra
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference26 articles.
1. Thermal management of electronic components with dielectric liquids;Bar-Cohen,1991
2. Natural convection heat transfer characteristics of simulated microelectronic chips;Park;ASME J. Heat Transfer,1987
3. Laminar natural convection in a rectangular enclosure due to a heated protrusion on one vertical wall. Part I: experimental investigation;Kelleher,1987
4. An experimental study of natural convection in a vertical cavity with discrete heat sources;Keyhani;ASME J. Heat Transfer,1988
5. Natural convection arising from a heat generating substrate-mounted protrusion in a liquid-filled two-dimensional enclosure;Sathe;Int. J. Heat Mass Transfer,1991
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28 articles.
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