Synthetic Jets for Thermal Management of Microelectronic Chips-Reference-Cited by-同舟云学术

Synthetic Jets for Thermal Management of Microelectronic Chips

Published:2005-01-01 Issue: Volume: Page:
ISSN:
Container-title:Microelectromechanical Systems
language:
Short-container-title:

Author:

Erbas N.¹,Koklu M.¹,Baysal O.¹

Affiliation:

1. Old Dominion University

Abstract

Thermal control of electronic devices has been an active research area of heat transfer technologies. The impetus is straightforward: decreasing the temperature of a component increases its performance as well as its reliability. In the present study, a single microchip is placed in a 2D channel. A simple triangular cavity configuration is used to investigate the effectiveness of a synthetic jet for its thermal management. The study presents altered main channel flow results for various synthetic jet configurations and different membrane oscillation frequencies. The effect is that synthetic jet enhances mixing by imparting momentum to the channel flow thus manipulating the temperature field in a positive manner. Computations carried out for both continuum and slip flow regimes.

Publisher

ASMEDC

Link

http://asmedigitalcollection.asme.org/IMECE/proceedings-pdf/doi/10.1115/IMECE2005-81419/2636690/273_1.pdf

Reference6 articles.

1. Aslan R.A, Baysal, O. and Firat, O. E., 2002, “Computing Micro Synthetic Jet in Slip Regime with Moving Membrane,” Paper IMECE2002-33770. Proc. 2002 ASME International Mechanical Engineering Congress and Exposition, New Orleans, LA.

2. Edis, F. O., Erbas, N., Baysal, O. and Aslan, R. A. 2003, “Micro Synthetic Jets and Their Interaction with a Cross Flow in Slip Regime,” International Conference on Recent Advances in Space Technologies. RAST 2003, Istanbul, Turkey.

3. Baysal O. , ErbasN., and KokluM., 2004, “Control of Separated Flow Past a Backward Facing Step in Microchannel.” Microfluidics and Nanofluidics, Vol. 1, pp. 86–92.

4. Kercher D. S , LeeJ. B., BrandO., AllenM. G, and GlezerA., 2004, “Microjet Cooling Devices for Thermal Management of Electronics,” IEEE Transactions on Components and Packaging Technologies, Vol. 26, pp. 359–366.

5. Mahalingam R. , RumingyN., and GlezerA., 2004, “Thermal Management Using Synthetic Jet Ejectors,” IEEE Transactions on Components and Packaging Technologies. Vol. 27. pp. 439–444.

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Computational and Experimental Investigation of Synthetic Jets for Cooling of Electronics;Journal of Electronic Packaging;2015-06-01

2. Steady and Unsteady Air Impingement Heat Transfer for Electronics Cooling Applications;Journal of Heat Transfer;2013-09-23

3. Predicting Heat Transfer From Unsteady Synthetic Jets;Journal of Heat Transfer;2012-05-31

4. Fluid-Structure Interaction Model for Low-Frequency Synthetic Jets;AIAA Journal;2011-02

5. Local Heat Transfer Coefficients of a High-Frequency Synthetic Jet during Impingement Cooling over Flat Surfaces;Heat Transfer Engineering;2008-09