Steady and Unsteady Air Impingement Heat Transfer for Electronics Cooling Applications
Author:
Affiliation:
1. Faculty of Engineering, Department of Mechanical Engineering, Ozyegin University Cekmekoy, 34782 Istanbul, Turkey e-mail:
2. Exponent Inc., Menlo Park, CA 94025
3. National Renewable Energy Laboratory, Golden, CO 80401
Abstract
Publisher
ASME International
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://asmedigitalcollection.asme.org/heattransfer/article-pdf/doi/10.1115/1.4024614/6206087/ht_135_11_111009.pdf
Reference37 articles.
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2. Petroski, J., Arik, M., and Gursoy, M., 2008, “Piezoelectric Fans: Heat Transfer Enhancements or Electronics Cooling,” ASME-JSME Thermal Engineering and Summer Heat Transfer Conference 2008, Jacksonville, FL, Aug. 10–14, HT-2008-56405.
3. Açikalin, T., Sauciuc, I., and Garimella, S. V., 2005, “Piezoelectric Actuators for Low-Form-Factor Electronics Cooling,” The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic Systems (InterPACK’05), San Francisco, July 17–22, IPACK2005-73288.
4. Local Heat Transfer Coefficients of a High Frequency Synthetic Jets During Impingement Cooling Over Flat Surfaces;Heat Transfer Eng.,2008
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