Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump Metallization
Author:
Affiliation:
1. Department of Materials Science, Fudan University, Shanghai 200433, China
2. Department of Materials Science, Fudan University, Shanghai 200433, China e-mail:
3. Jiangyin Changdian Advanced Packaging Co., Ltd., Jiangyin 214431, China
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4030974/6141477/ep_137_03_031016.pdf
Reference20 articles.
1. Advances in the Fabrication Processes and Applications of Wafer Level Packaging;ASME J. Electron. Packag.,2014
2. Multiple Impact Characterization of Wafer Level Packaging (WLP);Microelectron. Reliab.,2010
3. Design and Optimization of Thermo-Mechanical Reliability in Wafer Level Packaging;Microelectron. Reliab.,2010
4. Xu, S., Keser, B., Hau-Riege, C., Bezuk, S., and Yau, Y. W., 2013, “A Study of Wafer Level Package Board Level Reliability,” IEEE 63rd Electronic Components and Technology Conference (ECTC), Las Vegas, NV, May 28–31, pp. 1204–1209.http://dx.doi.org/10.1109/ECTC.2013.6575728
5. Analytical Solutions and a Numerical Approach for Diffusion-Induced Stresses in Intermetallic Compound Layers of Solder Joints;ASME J. Electron. Packag.,2013
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