Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response
Author:
Affiliation:
1. Department of Mechanical Engineering, Lamar University, 4400 MLK Drive, Beaumont, TX 77705 e-mail:
2. Professor Department of Mechanical Engineering, Lamar University, 4400 MLK Drive, Beaumont, TX 77705 e-mail:
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4034187/6142198/ep_138_04_041001.pdf
Reference15 articles.
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2. Ranouta, A. S., Fan, X. J., and Han, Q., 2009, “Shock Performance Study of Solder Joints in Wafer Level Packages,” International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP '09), Beijing, China, Aug. 10–13, pp. 1266–1276.10.1109/ICEPT.2009.5270604
3. Board Level Drop Test Method of Components for Handheld Electronic Products;JEDEC,2003
4. Dynamic Response of a Rectangular Plate to a Shock Load, With Application to Portable Electronic Product;IEEE Trans. Compon., Packag., Manuf. Technol.,1994
5. Is the Maximum Acceleration an Adequate Criterion of the Dynamic Strength of a Structural Element in an Electronic Product?;IEEE Trans. Compon., Packag., Manuf. Technol.,1997
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