Shock performance study of solder joints in wafer level packages
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/5234372/5270539/05270604.pdf?arnumber=5270604
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Case Study-Based Report on Solid-State Lighting;2022 Advances in Science and Engineering Technology International Conferences (ASET);2022-02-21
2. Overview and application of FEM methods for shock analysis in space instruments;Aerospace Science and Technology;2018-09
3. Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response;Journal of Electronic Packaging;2016-08-10
4. An approach to adjust the board-level drop test conditions to improve the correlation with product-level drop impact;Microelectronics Reliability;2014-04
5. Effects of Package Level Structure and Material Properties on Solder Joint Reliability Under Impact Loading;IEEE Transactions on Components, Packaging and Manufacturing Technology;2013-01
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