1. JESD22-B111. Board level drop test method of components for handheld electronic products. JEDEC Solid State Technology Association; 2003. 16 p.
2. IEC 62137-1-3. Surface mounting technology – environmental and endurance test methods for surface mount solder joint – Part 1–3: Cyclic drop test. International Electrotechnical Commission; 2008. 46 p.
3. ETSI Standard ETSI EN 300 019-2-7. Environmental Engineering (EE); Environmental Conditions and Environmental Tests for Telecommunications Equipment; Part 2–7: Specification of Environmental Tests; Portable and Non-Stationary Use.
4. Standard test methods for mechanical-shock fragility of products using shock machines;ASTM D3332-99,2004
5. Mattila TT, Vajavaara L, Hussa E, Mäkelä M, Sillanpää M, Luo G, et al. Evaluation of the drop response of handheld electronic products, (in press), (Available online 24 December 2013).