A Scalable Multi-Functional Thermal Test Chip Family: Design and Evaluation-Reference-Cited by-同舟云学术

A Scalable Multi-Functional Thermal Test Chip Family: Design and Evaluation

Published:2001-06-02 Issue:4 Volume:123 Page:323-330
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Benedek Zs.¹,Courtois B.²,Farkas G.³,Kolla´r E.⁴,Mir S.⁵,Poppe A.³,Rencz M.³,Sze´kely V.⁴,Torki K.⁶

Affiliation:

1. Department of Electron Devices, Budapest University of Technology and Economics (formerly TUB), Budapest XI, Goldmann Gy. Te´r 3, H-1111 Hungary

2. TIMA Laboratory, 46 Avenue Fe´lix Viallet, 38031, Grenoble, Cedex France

3. MicReD Ltd., Budapest XI, Gulya´s u.27, H-1112 Hungary

4. Department of Electron Devices, Budapest University of Technology and Economics, Budapest, Hungary

5. TIMA Laboratory, 46 Avenue Fe´lix Viallet, 38031, Grenoble, Cedex, France

6. TIMA Laboratory, 46 Avenue Fe´lix Viallet, 38031 Grenoble, Cedex, France

Abstract

Nowadays, thermal characterization of IC packages and packaging technologies is becoming a key task in thermal engineering. To support this by measurements, we developed a family of thermal test chips that allow a wide range of possible applications. Our chips are based on the same basic cell that is mainly covered by dissipating resistors and also contains a temperature sensor. These basic cells are organized into arrays of different size. The arrays are designed such that further “super arrays” can also be built for tiling up larger package cavities. The first members of the family, TMC9 and TMC81, have been manufactured. Our measurements show that the goals aimed at the design have been achieved.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/123/4/323/5730281/323_1.pdf

Reference14 articles.

1. http://www.thermengr.com/tea51.html

2. Claassen, Alan, and Shaukatullah, H., 1997, “Comparison of Diodes and Resistors for Measuring Chip Temperature During Thermal Characterization of Electronic Packages Using Thermal Test Chips,” Proc. of the 13th IEEE SEMI-THERM™ Symposium.

3. Manual for using Delco Electronics thermally sensitive chip, D.L. Rodkey Delco Electronics 1/30/87.

4. Jablonski, G., et al., 1997, “Thermal Benchmark Integrated Circuit in BiCMOS Technology,” Informal Proceedings, 3rd THERMINIC Workshop, 21–23 Sept., Cannes, France, pp. 34–36.

5. http://www.micred.com/prodserv/products/measdev/test_dies.

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Test Vehicle for HPC – System Level Approach for Investigation of the Thermal Heat Path Signature with the Property of Spatial Resolution;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27

2. Framework for thermal-aware verification of digital and mixed signal systems;Microelectronics Reliability;2017-12

3. Design, Characterization, and Application of a Field-Programmable Thermal Emulation Platform;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-09

4. Design and fabrication of a reliability test chip for 3D-TSV;2010 Proceedings 60th Electronic Components and Technology Conference (ECTC);2010-06

5. Testing Interface Thermal Resistance;2007 9th Electronics Packaging Technology Conference;2007-12