Design, Characterization, and Application of a Field-Programmable Thermal Emulation Platform
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Published:2016-09
Issue:9
Volume:6
Page:1330-1339
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ISSN:2156-3950
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Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
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language:
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Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.
Author:
Yueh WenORCID,
Wan Zhimin,
Joshi Yogendra,
Mukhopadhyay Saibal
Funder
National Science Foundation
Sandia National Laboratory
Semiconductor Research Corporation
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials