Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects
Author:
Okura J. H.1, Dasgupta A.2, Caers J. F. J. M.3
Affiliation:
1. Nokia Mobile Phones, Connection Drive 6000, Irving, TX 75039 2. CALCE Electronic Products and Systems Consortium, University of Maryland, College Park, MD 20742 3. Philips Centre for Manufacturing Technology, P. O. Box 218, 5600 MD Eindhoven, The Netherlands
Abstract
The effect of constant temperature and humidity environments on the durability of interconnects in underfilled Flip-Chip-on-Board (FCOB) assemblies is investigated in this study. Polymeric underfills, used to enhance thermomechanical durability of the interconnects, are found to create new failure modes due to hygromechanical swelling. Based on experimental observations, the failure mechanism is hypothesized to be cracking of intermetallics, which have weakened due to thermal aging. Pseudo 3-D finite element analyses are conducted to quantify the moisture absorption and diffusion through the polymeric underfill, and the resulting hygromechanical viscoplastic stress history. The simulations are combined with accelerated aging tests to assess in-service durability in hot, humid environments. Model predictions are compared with results of accelerated life tests available in the literature.
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. Darbha, K., Okura, J. H., and Dasgupta, A., 1999, “Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill,” ASME J. Electron. Packag., 121, pp. 231–236. 2. Darbha, K., Okura, J. H., Shetty, S., Dasgupta, A., Reinikainen, T., Zhu, J., and Caers, J. F. J. M., 1999, “Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill,” ASME J. Electron. Packag., 121, 237–241. 3. Okura, J. H., Darbha, K., and Dasgupta, A., 1998, “Effect of Underfill in Flip Chip on Board Assemblies,” ASME Winter Annual Conference, Anaheim, CA. 4. Ramakrishna, K., and Johnson, Z., 1997, “Effect of Material and Design Parameters on the Stresses Induced in a Direct-Chip-Attach Package During Underfill Cure,” 1997, Proceedings, ASME Interpack’97, EEP-Vol. 19-2, Advances in Electronic Packaging. 5. Lau, J. H., and Pao, Y., 1997, “Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies,” McGraw Hill, New York, NY.
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
|
|