Author:
Lin Chang,Suhling Jeffrey C.,Lall Pradeep
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of Material Aging on the Reliability of an Automotive BGA Device Under Temperature Cycling Test Conditions;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Degradation Mechanisms of Epoxy Molding Compound Subjected to High Temperature Long Term Aging;2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2021-06-01