Effect of Material Aging on the Reliability of an Automotive BGA Device Under Temperature Cycling Test Conditions-Reference-Cited by-同舟云学术

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Effect of Material Aging on the Reliability of an Automotive BGA Device Under Temperature Cycling Test Conditions

Published:2024-05-28 Issue: Volume: Page:2062-2069
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Fahim Abdullah¹,Zhang Ryan²,Mavinkurve Amar³,Shantaram Sandeep¹,Adli Ali Rezaie³,Tanwongwan Wiwat⁴,Hauck Torsten⁵

Affiliation:

1. NXP Semiconductors,Austin,USA

2. NXP Semiconductors,Tianjin,China

3. NXP Semiconductors,Nijmegen,Netherland

4. NXP Semiconductors,Bangkok,Thailand

5. NXP Semiconductors,Munich,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565124.pdf?arnumber=10565124

Reference11 articles.

1. Suitable Cu Leadframe Material and Design to Achieve High Reliability Requirement and Good Manufacturability

2. Thermal aging of molding compounds

3. Epoxy molding compounds for high temperature applications;Mavinkurve

4. Physical aging and evolving mechanical behavior of underfill encapsulants

5. The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials

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