Heat Exchanger Design Methodology for Electronic Heat Sinks

Author:

Webb Ralph L.1

Affiliation:

1. Department of Mechanical and Nuclear Engineering, Penn State University, University Park, PA 16802

Abstract

This paper discusses the “inlet temperature difference” (ITD) based heat-exchanger (and its variants) design methodology frequently used by designers of electronic heat sinks. This is at variance with the accepted methodology recommended in standard heat-exchanger textbooks—the “log-mean temperature difference,” or the equivalent ε-NTU design method. The purpose of this paper is to evaluate and discuss the ITD based design methodology. The paper shows that the ITD based method is an approximation at best. Variants of the method can lead to either under- or overprediction of the heat transfer rate. Its shortcomings are evaluated and designers are directed to the well established and accepted design methodology.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference4 articles.

1. A Simple Thermal Resistance Model—Isoflux Versus Isothermal;Simons

2. Constriction/Spreading Resistance Model for Electronics Packaging;Lee

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