Subject
Fluid Flow and Transfer Processes,Engineering (miscellaneous)
Reference33 articles.
1. Optimising integrated heat spreaders with distributed heat transfer coefficients: a case study for CPU cooling;Elliott;Case Stud. Therm. Eng.,2022
2. Intel product specifications, (n.d.). https://www.intel.com/content/www/us/en/ark.html (accessed May 16, 2023).
3. Validation of models for air cooled plane fin heat sinks used in computer cooling;Saini,2002
4. Heat rejection limits of air cooled plane fin heat sinks for computer cooling;Saini;IEEE Trans. Compon. Packag. Technol.,2003
5. Emerging challenges and materials for thermal management of electronics;Moore;Mater. Today,2014
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献