Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis
Author:
Affiliation:
1. College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, P. R. China
2. Fairchild Semiconductor Corp., S. Portland, ME 04106
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4004658/5669885/031002_1.pdf
Reference24 articles.
1. Electromigration Induced Stress Analysis Using Fully Coupled Mechanical–Diffusion Equations With Nonlinear Material Properties;Lin;Comput. Mater. Sci.
2. Electromigration Induced Strain Field Simulations for Nanoelectronics Lead-Free Solder Joints;Basaran;Int. J. Solids Struct.
3. Damage Mechanics of Electromigration Induced Failure;Basaran;Mech. Mater.
4. Three-dimensional Voids Simulation in Chip-level Metallization Structures: A Contribution to Reliability Evaluation;Dalleau;Microelectron. Reliab.
5. Dalleau, D. , 2003, “3D Time-Depending Simulation of Void Formation in Metallization Structures”, Ph.D. thesis, University of Hannover, Hannover.
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2. The Study of the Reliability of Complex Components during the Electromigration Process;Micromachines;2023-02-21
3. Effect of Grain Structure and Ni/Au-UBM Layer on Electromigration-Induced Failure Mechanism in Sn-3.0Ag-0.5Cu Solder Joints;Micromachines;2022-06-16
4. Modeling Effect of Grain Orientation on Degradation in Tin-Based Solder: I. Current-Driven Diffusion;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-03
5. Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints;Journal of Materials Science: Materials in Electronics;2019-02-19
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