Relative Contributions of Inelastic and Elastic Diffuse Phonon Scattering to Thermal Boundary Conductance Across Solid Interfaces

Author:

Hopkins Patrick E.1,Norris Pamela M.1

Affiliation:

1. Department of Mechanical and Aerospace Engineering, University of Virginia, P.O. Box 400746, Charlottesville, VA 22904-4746

Abstract

The accuracy of predictions of phonon thermal boundary conductance using traditional models such as the diffuse mismatch model (DMM) varies depending on the types of material comprising the interface. The DMM assumes that phonons, undergoing diffuse scattering events, are elastically scattered, which drives the energy conductance across the interface. It has been shown that at relatively high temperatures (i.e., above the Debye temperature) previously ignored inelastic scattering events can contribute substantially to interfacial transport. In this case, the predictions from the DMM become highly inaccurate. In this paper, the effects of inelastic scattering on thermal boundary conductance at metal/dielectric interfaces are studied. Experimental transient thermoreflectance data showing inelastic trends are reviewed and compared to traditional models. Using the physical assumptions in the traditional models and experimental data, the relative contributions of inelastic and elastic scattering to thermal boundary conductance are inferred.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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