Multi-Physics Three-Dimensional Component Placement and Routing Optimization Using Geometric Projection

Author:

Bello Waheed B.1,Peddada Satya R. T.2,Bhattacharyya Anurag3,Zeidner Lawrence E.4,Allison James T.2,James Kai A.1

Affiliation:

1. Georgia Institute of Technology Department of Aerospace Engineering, , Atlanta, GA 30332

2. University of Illinois at Urbana Champaign Department of Industrial and Enterprise Systems Engineering, , Urbana, IL 61801

3. University of Illinois at Urbana Champaign Department of Aerospace Engineering, , Urbana, IL 61801

4. Raytheon Technologies Research Center , East Hartford, CT 06108

Abstract

Abstract This article presents a novel three-dimensional topology optimization framework developed for 3D spatial packaging of interconnected systems using a geometric projection method (GPM). The proposed gradient-based topology optimization method simultaneously optimizes the locations and orientations of system components (or devices) and lengths, diameters, and trajectories of interconnects to reduce the overall system volume within the prescribed 3D design domain. The optimization is subject to geometric and physics-based constraints dictated by various system specifications, suited for a wide range of transportation (aerospace or automotive), heating, ventilation, air-conditioning, and refrigeration, and other complex system applications. The system components and interconnects are represented using 3D parametric shapes such as cubes, cuboids, and cylinders. These objects are then projected onto a three-dimensional finite element mesh using the geometric projection method. Sensitivities are calculated for the objective function (bounding box volume) with various geometric and physics-based (thermal and hydraulic) constraints. Several case studies were performed with different component counts, interconnection topologies, and system boundary conditions and are presented to exhibit the capabilities of the proposed 3D multi-physics spatial packaging optimization framework.

Funder

Division of Engineering Education and Centers

Publisher

ASME International

Subject

Computer Graphics and Computer-Aided Design,Computer Science Applications,Mechanical Engineering,Mechanics of Materials

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