High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting-Reference-Cited by-同舟云学术

High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

Published:2020-04-17 Issue:3 Volume:142 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Yang Yi¹,Long Tao²,Zhuang Songlin²,Wang Lai³,Luo Yi³

Affiliation:

1. School of Optical-Electrical and Computer Engineering, University of Shanghai for Science and Technology, 516 Jungong Road, Shanghai 200093, China; Shanghai Blue Lake Lighting Technology Co., Ltd., 128 Xiangyin Road, Shanghai 200093, China

2. School of Optical-Electrical and Computer Engineering, University of Shanghai for Science and Technology, 516 Jungong Road, Shanghai 200093, China

3. Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing 100084, China

Abstract

Abstract Inorganic Ce doped yttrium aluminum garnet (YAG:Ce) fluorescent plates based on various manufacturing methods have been studied in recent years for laser lighting systems. A laser lighting optical system is designed to generate high central intensity beam, and light spreading effect for both YAG single crystal and YAG/Al2O3 composite is investigated. YAG single crystal and YAG/Al2O3 composite lose 50.8% and 25.9% of their light power from central pumping area, respectively, resulting in proportional decrease in central intensity. To solve this problem, a low-cost YAG:Ce high-particle-density phosphor coating (HPD-PC) was prepared for Etendue-limited applications. With only 8.5% of light spreading, under 47.7 W/mm2 pumping power density, YAG HPD-PC emits 1880 lm with the conversion efficiency of 157 lm/W. YAG HPD-PC also could work well under power density more than 100 W/mm2.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4046763/6526838/ep_142_03_031101.pdf

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