Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading-Reference-Cited by-同舟云学术

Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading

Published:2003-09-01 Issue:3 Volume:125 Page:420-425
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Saitoh Takehiro¹,Matsuyama Hidehito²,Toya Masayuki³

Affiliation:

1. Advanced Technology Development Division, NEC Electronics Corp., 1120, Shimokuzawa, Sagamihara, Kanagawa, 229-1198 Japan

2. Scientific Systems Division, NEC Informatec Systems, Ltd., 3-2-1, Sakado, Takatsu, Kawasaki, Kanagawa, 213-0012 Japan

3. Department of Mechanical Engineering, Kagoshima University, 1-21-40, Kohrimoto, Kagoshima, Kagoshima, 890-0065 Japan

Abstract

Using Kr85 radioactive tracer techniques, initial sites of edge delaminations occurring during temperature cyclic tests in large-scale integrated circuit (LSI) plastic packages with either Cu alloy or alloy 42 leadframes are experimentally identified. Based on the experimental results, the processes of delamination growth and subsequent resin cracking are clarified. The effect of the length of the delaminations on the resin cracking is numerically analyzed on the basis of the linear fracture mechanics approach combined with finite element calculations. The directions of resin cracking predicted from the analysis are found to agree well with those of actual packages.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/125/3/420/5883321/420_1.pdf

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