Study of delaminated plastic packages by high temperature Moire and finite element method-Reference-Cited by-同舟云学术

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Study of delaminated plastic packages by high temperature Moire and finite element method

Published:1997 Issue:4 Volume:20 Page:505-512
ISSN:1070-9886
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. A

Author:

Sheng Liu ,Jiansen Zhu ,Daqing Zou ,Benson J.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/95/14192/00650941.pdf?arnumber=650941

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moiré Interferometry;IEEE Transactions on Components and Packaging Technologies;2010-03

2. Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection;Journal of Adhesion Science and Technology;2008-01

3. Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications;Journal of Electronic Packaging;2005-03-01

4. Curing behavior and residual stresses in polymeric resins used for encapsulanting electronic packages;Journal of Applied Polymer Science;2005

5. Finite-element modelling of non-destructive material evaluation, an addendum: a bibliography (1997–2003);Modelling and Simulation in Materials Science and Engineering;2004-07-06

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