Solder Joint Formation in Surface Mount Technology—Part I: Analysis-Reference-Cited by-同舟云学术

Solder Joint Formation in Surface Mount Technology—Part I: Analysis

Published:1990-09-01 Issue:3 Volume:112 Page:210-218
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Heinrich S. M.¹,Elkouh A. F.²,Nigro N. J.²,Lee Ping S.³

Affiliation:

1. Civil Engineering, Marquette University, Milwaukee, WI 53233

2. Mechanical Engineering, Marquette University, Milwaukee, WI 53233

3. Allen-Bradley, A Rockwell International Company, Milwaukee, WI 53204

Abstract

An analytical model of solder joint formation during a surface mount reflow process is developed in the present paper, and the solution is obtained in an explicit integral form. For two limiting cases—infinitesimal and infinite solder areas—the solution is expressed in closed form. Numerical results illustrate the influence of the process parameters (surface tension, density, and cross-sectional area of the molten solder, and the contact angles between the solder andpretinning) on joint shape and overall fillet dimensions. Comparisons between theoretical predictions and laboratory data show excellent agreement.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/112/3/210/5632628/210_1.pdf

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