Optimum Gullwing Fillet Solder Joint Under Thermomechanical Forces
Author:
Meekisho L. L.1, Nelson-Owusu K.2
Affiliation:
1. Portland State University, Portland, OR 97207 2. Washington County, LUT, 155 N First Ave MS 350-12, Hillsboro, OR 97124
Abstract
The final shape of a solidified solder fillet joint from a reflow process is determined by process parameters and the solder alloy’s physical properties, including surface tension, density, gravity, and wetting angles. This work investigates the influence of surface tension at the solder-atmosphere interface; gravitational effects on the solder, and the influence of wetting angles on the mechanical response of the solder joint when subjected to thermomechanical loads. The predicted optimum fillet shape with minimum fillet area corresponded to the case where the ratio of gravity-to-surface tension forces is almost zero, and wetting angles, θ1 and θ2 being 90 deg. Results from this study suggest that, the influence of gravity on the molten solder geometry is negligible and hence can be assumed to be inconsequential to solder joint reliability issues.
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference13 articles.
1. Heinrich, S. M., et al., 1993, “Effects of Chip and Pad Geometry on Solder Joint Formation in SMT,” ASME J. Electron. Packag., 115, pp. 433–439. 2. Lee, T. S.
, 1997, “Finite Element Modeling of 3-Dimensional Solder Joints Geometry in SMT,” ASME J. Electron. Packag., 119, pp. 118–125. 3. Nelson-Owusu, Kofi., 2000, “The Thermal-Structural Optimization and Reliability of Leadframe Solder Joint Geometry in Electronic Packaging,” Ph.D. Dissertation, Department of Material Science and Engineering, Oregon Graduate Institute of Science and Technology, Portland, OR. 4. Meekisho, L., and Nelson-Owusu, K., 2000, “Stress Analysis of Solder Joint with Torsional Eccentricity Subjected to Based Excitation,” Journal of Mathematical Modelling and Scientific Computing, 10, pp. 193–199. 5. Heinrich, S. M., et al., 1990, “Solder Joint Formation in Surface Mount Technology, Part 2: Design,” ASME J. Electron. Packag., 113(3), pp. 219–223.
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