Shape Dependency of Fatigue Life in Solder Joints of Chip Resistors
Author:
Affiliation:
1. The State University of New York at Binghamton,Department of Mechanical Engineering,Binghamton,US
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816426.pdf?arnumber=9816426
Reference27 articles.
1. Investigating micro-alloyed solders with thermal shock tests
2. The impact of thermal cycle regime on the shear strength of lead-free solder joints;dusek;NPL report MATC (A),2003
3. Predicting Component Self-Alignment in Lead-Free Reflow Soldering Technology by Virtue of Force Model
4. Solder Joint Formation in Surface Mount Technology—Part I: Analysis
5. Evaluation of two-dimensional and three-dimensional axisymmetric fluid interface shapes with boundary conditions
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Reliability of Differently Shaped Solder Joints in Chip Resistor Under Drop Impact;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Influence of Copper Pad Dimension on Thermal Fatigue Life Performance of BGA Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-09
3. Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life;Journal of Electronic Packaging;2023-08-17
4. Reflow profiling with the aid of machine learning models;Soldering & Surface Mount Technology;2023-06-01
5. Reflow Oven Zone Temperature Advisor using the AI-Driven Smart Recipe Generator;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3