Influences of Exothermic Reactive Layer and Metal Interlayer on Fracture Behavior of Reactively Bonded Solder Joints-Reference-Cited by-同舟云学术

Influences of Exothermic Reactive Layer and Metal Interlayer on Fracture Behavior of Reactively Bonded Solder Joints

Published:2015-07-01 Issue:3 Volume:137 Page:
ISSN:0094-4289
Container-title:Journal of Engineering Materials and Technology
language:en
Short-container-title:

Author:

Namazu Takahiro¹,Ohtani Kohei²,Inoue Shozo²,Miyake Shugo³

Affiliation:

1. Associate Professor Division of Mechanical Systems, Department of Mechanical and Systems Engineering, University of Hyogo, 2167 Shosha, Himeji, Hyogo 671-2201, Japan e-mail:

2. Division of Mechanical Systems, Department of Mechanical and Systems Engineering, University of Hyogo, 2167 Shosha, Himeji, Hyogo 671-2201, Japan

3. Kobelco Research Institute Inc., 1-5-5 Takatsukadai, Nishi-ku, Kobe, Hyogo 651-2271, Japan

Abstract

Reactively bonded solder joints with Al/Ni exothermic films attract much attention in semiconductor and microelectromechanical systems (MEMS) industries. Higher bond strength of the joints is required for long-term mechanical reliability. We have investigated the strength of rectangular-solid single crystal silicon (SCS) specimens with reactively bonded Sn-3.5Ag solder joint by using specially developed four-point bending test equipment. In this paper, the influences of Al/Ni exothermic film thickness and metallic interlayer on the strength are discussed. The strength increases with increasing Al/Ni film thickness and pressure load during bonding. Metallic interlayer between the solder and SCS also affects the strength because fracture origin is dependent on the types of metals. The obtained results suggest that reacted NiAl is durable against external forces compared with the solder and interlayer.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

http://asmedigitalcollection.asme.org/materialstechnology/article-pdf/doi/10.1115/1.4030413/6135685/mats_137_03_031011.pdf

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