The Influence of the Thermal Conductivity on the Heat Transfer Performance in a Heat Sink
Author:
Ma H. B.1, Peterson G. P.2
Affiliation:
1. Mechanical & Aerospace Engineering Department, University of Missouri-Columbia, Columbia, MO 65211 2. Mechanical Engineering Department, Texas A&M University, College Station, TX 77843
Abstract
An extensive numerical analysis of the temperature distribution and fluid flow in a heat sink currently being used for cooling desktop computers was conducted, and demonstrated that if the base of a heat sink was fabricated as a heat pipe instead of a solid material, the heat transfer performance could be significantly increased. It was shown that as the heat sink length increases, the effect of the thermal conductivity of the base on the heat transfer performance increases to be a predictable limit. As the thermal conductivity is increased, the heat transfer performance of heat sinks is enhanced, but cannot exceed this limit. When the thermal conductivity increases to 2,370 W/m-K, the heat transfer performance of the heat sinks will be very close to the heat transfer performance obtained assuming a base with infinite thermal conductivity. Further increases in the thermal conductivity would not significantly improve the heat transfer performance of the heat sinks.
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference6 articles.
1. Ma, H. B., and Peterson, G. P., 1998, “High Heat Flux Cooling Devices for Desktop Computers,” Technical Report, Intel Corporation. 2. Peterson, G. P., 1994, An Introduction to Heat Pipes, Wiley, New York. 3. Benson, D. A., Adkins, D. R., Mitchell, R. T., Tuck, M. R., Palmer, D. W., and Peterson, G. P., 1998, “Ultra High Capacity Micro Machined Heat Spreaders,” Microscale Thermophysical Engineering, 2(1), pp. 21–29. 4. Mansuria, M. S., and Kamath, V., 1994, “Design Optimization of a High-Performance Heat-Sink/Fan Assembly,” Heat Transfer in Electronic Systems, ASME HTD-Vol. 292, pp. 95–104. 5. Wirtz, R. A., Sohal, R., and Wang, H., 1997, “Thermal Performance of Pin-Fin Fan-Sink Assemblies,” ASME J. Electron. Packag., 119(1), pp. 26–31.
Cited by
13 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
|
|