Thermal Performance of Pin-Fin Fan-Sink Assemblies-Reference-Cited by-同舟云学术

Thermal Performance of Pin-Fin Fan-Sink Assemblies

Published:1997-03-01 Issue:1 Volume:119 Page:26-31
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Wirtz R. A.¹,Sohal R.¹,Wang H.¹

Affiliation:

1. Mechanical Engineering Department, MS312, University of Nevada, Reno, Reno, NV 89557

Abstract

Experiments are reported on the thermal performance of model fan-sink assemblies consisting of a small axial flow fan which impinges air on a square array of pin-fins. Cylindrical, square, and diamond shape cross section pin-fins are considered. The pin-fin heat transfer coefficient is found to be maximum immediately under the fan blades and minimum below the fan hub and near the corners of the array. The overall heat sink thermal resistance, R, decreases with an increase in either applied pressure rise or fan power and fin height. At fixed applied pressure rise, R is minimized when the fin pitch-to-diameter ratiois maximum. At fixed fan power, R is minimized when the pitch-to-diameter ratio is reduced toward unity. Finally, cylindrical pin-fins give the best overall fan-sink performance.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/119/1/26/5566975/26_1.pdf

Reference6 articles.

1. Larson E. D. , and SparrowE. M., 1982, “Performance Comparisons Among Geometrically Different Pin-Fin Arrays Situated in an Oncoming Longitudinal Flow,” International Journal of Heat Mass Transfer, Vol. 25, pp. 723–725.

2. Mansuria, M. S., and Kamath, V. 1994, “Design Optimization of a High-Performance Heat-Sink/Fan Assembly,” Heat Transfer in Electronic Systems, R. A. Wirtz, D. Agonafer, C. H. Amon, S. Lee, and L.-T. Yeh, eds., HTD-Vol. 292, pp. 95–104, ASME Press, New York, NY.

3. Sathe, S., Kelkar, K. M., Tai, C., Lamb, C., and Patankar, S. V., 1993, “Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink,” Advances in Electronic Packaging, EEP-Vol. 4–2, pp. 893–898.

4. Sohal, R., 1994 “Thermal Performance of Cylindrical Pin-Fin Fan-Sink Assemblies,” M.S. Thesis, Mechanical Engineering Department, University of Nevada, Reno, Nevada, 89557.

5. Sparrow E. M. , and LarsonE. D., 1982, “Heat Transfer From Pin-Fins Situated in an Oncoming Longitudinal Flow Which Turns to Crossflow,” International Journal of Heat Mass Transfer, Vol. 25, pp. 603–614.

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