Study on the Factors Influencing Spreading Resistance of Heat Sinks-Reference-Cited by-同舟云学术

Study on the Factors Influencing Spreading Resistance of Heat Sinks

Published:2011-07 Issue: Volume:301-303 Page:165-169
ISSN:1662-8985
Container-title:Advanced Materials Research
language:
Short-container-title:AMR

Author:

Gao Da Yong¹,Zhang Jian Xin¹,Niu Ping Juan¹

Affiliation:

1. Polytechnics University of Tianjin

Abstract

The spreading resistance is a very important parameter in the applications of heat sink. The design of electronic devices will fail without considering the influence of the spreading resistance. In this paper, a simple thermal model was simulated by Computational Fluid Dynamics software. Some factors, which have great influence on the spreading resistance, have been analyzed. The spreading resistance decreases significantly with the increasing of the area ratio between the heat source and the base-plate. While the ratio being 1, the spreading resistance reaches the mix value. The greater the thermal conductivity of heat sink, the lower the spreading resistance. With the increasing of the thickness of base-plate, the spreading resistance reduces. However, if the thickness exceeds the critical value, the spreading resistance will increase. And the spreading resistance reaches the mix value while the centers of heat source and the base-plate are overlapped.

Publisher

Trans Tech Publications, Ltd.

Subject

General Engineering

Link

https://www.scientific.net/AMR.301-303.165.pdf

Reference5 articles.

1. Ma,H.B. and Peterson, G.P., The influence of the Thermal Conductivity on the Heat Transfer Performance in a Heat Sink, ASME, J. Electronic Packing, 124, pp.1-6, (2002).

2. J. R. Culham, M. M. Yovanovich, and Y. S. Muzychka, Spreading Resistance of Isoflux Rectangles and Strips on Compound Flux Channels, J. Thermophysics and heat Transfer, 13, No 1 pp.495-500, (1999).

3. S. Lee, Calculating Spreading Resistance in Heat Sinks, Electronics Cooling, Vol. 4, No. 1 pp.30-33, (1998).

4. S. Lee, S. Song, V. Au, and K.P. Moran, Constriction/Spreading Resistance Model for Electronic Packaging, Proceedings of the 4th ASME/JSME Thermal Engineering Joint Conference, Vol. 4, pp.199-206, (1995).

5. S. Song, S. Lee, and V. Au, Closed Form Equation for Thermal Constriction/Spreading Resistances with Variable Resistance Boundary Condition, Proceedings of the 1994 IEPS Conference, pp.111-121, (1994).