Tools for Stress Analysis of Microelectronic Structures
Author:
Affiliation:
1. Weidlinger Associates Inc, Consulting Engineers, One Broadway, 11th Floor, Cambridge, MA 02142-1100
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/122/3/280/5595662/279_1.pdf
Reference5 articles.
1. Orringer, O. and Tong, P., 1984, “Uses and abuses of the finite element method,” Proceedings of SPIE, the International Society for Optical Engineering, Vol. 450, Bellingham, Washington, DC, pp. 2–33.
2. Subbarayan, G., Ramakrishna, K., and Sammakia, B. G., 1997, “The Impact of Interfacial Adhesion on PTH and Via Stress State,” ASME J. Electron. Packag., 119, pp. 260–267.
3. Engelmaier, W. , 1988, “Plated Through Hole Failures in Thermal Cycling: Analytical Considerations,” Technical Report IPC-TR-579, Lincolnwood, IL.
4. Mirman, B. , 1988, “Mathematical Model of a Plated-Through Hole under a Load Induced by Thermal Mismatch,” IEEE Trans., CHMT, 11, No. 4, pp. 506–511.
5. Safranek, W. H., 1986, “The Properties of Electrodeposited Metals and Alloys,” American Electroplaters and Surface Finishers Society, Handbook.
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