The Impact of Interfacial Adhesion on PTH and Via Stress State-Reference-Cited by-同舟云学术

The Impact of Interfacial Adhesion on PTH and Via Stress State

Published:1997-12-01 Issue:4 Volume:119 Page:260-267
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Subbarayan G.¹,Ramakrishna K.²,Sammakia B. G.³

Affiliation:

1. Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309-0427

2. Advanced Interconnect Systems Laboratories, Semiconductor Products Sector, Motorola, Inc., Austin, TX 78730

3. Materials Science, Endicott Electronic Packaging, Microelectronics Division, IBM Corporation, Endicott, NY 13760

Abstract

In this paper the impact of the state of barrel-laminate adhesion on the PTH and via stresses is investigated. A representative PTH and a representative blind via in a printed wiring board are used as demonstration vehicles. Transient heat conduction and nonlinear elastic-plastic-contact finite element analyses are carried out on PTHs and vias under the extreme conditions of perfect and zero barrel-laminate adhesion. In general, the maximum equivalent plastic strains in PTHs and vias with strong barrel-laminate adhesion are not large enough to fracture the plating. Fracture is possible at or near the innerplane junction when barrel-laminate adhesion is lost. The possibility of plating fracture in a blind via is strongly dependent on the tolerances in manufacturing process parameters such as drill depth and laminate thickness.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/119/4/260/5513551/260_1.pdf

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