Failures of electronic devices: solder joints failure modes, causes and detection methods-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Failures of electronic devices: solder joints failure modes, causes and detection methods

Published:2020 Issue: Volume: Page:3-17
ISSN:
Container-title:Handbook of Materials Failure Analysis
language:
Short-container-title:

Author:

Gharaibeh Mohammad A.,Makhlouf Abdel Salam Hamdy

Publisher

Elsevier

Reference23 articles.

1. Finite Element Modeling, Characterization and Design of Electronic Packages Under Vibration;Gharaibeh,2015

2. Tools for stress analysis of microelectronic structures;Mirman;J. Electron. Packag.,2000

3. Review of board-level solder joint reliability under environmental stress;Fang,2016

4. Lead-free solders in microelectronics;Abtew;Mater. Sci. Eng.: R: Rep.,2000

5. Microstructural Evolution During the Thermomechanical Fatigue of Solder Joints;Frear,1991

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A study on the thermomechanical response of various die attach metallic materials of power electronics;Soldering & Surface Mount Technology;2024-05-09

2. Research on the creep response of lead-free die attachments in power electronics;International Journal of Structural Integrity;2024-05-07

3. Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents;Soldering & Surface Mount Technology;2023-08-28

4. A numerical investigation on the influence of full vs perimeter arrays on the mechanical reliability of electronic assemblies under vibration;Microelectronics International;2023-07-28

5. Wafer-level chip-scale package lead-free solder fatigue: A critical review;Engineering Failure Analysis;2023-02

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3