Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM-Reference-Cited by-同舟云学术

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

Published:1999-05-21 Issue:2 Volume:122 Page:172-177
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Yu Z. Q.¹,Chan Y. C.¹,Webb D. P.¹,Li G. Y.¹

Affiliation:

1. Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong

Abstract

Delaminations of embedded passive components are often associated with reliability problems. Understanding the delamination can help us quickly identify the failure caused at an early stage of failure analysis. In this work, defects in buried capacitors have been detected by use of scanning acoustic microscopy (SAM). Defects in buried capacitors caused by thermal shock have also been clearly observed. The results show that SAM can be a powerful analytical tool for the nondestructive evaluation of delaminations in buried passive components. Through transmission scan (THRU-scan) is a fast method to detect the existence of internal defects, while Tomographic Acoustic Multiple Imaging scan (TAMI-scan) is shown to be capable of detecting the location and size of delaminations and voids. [S1043-7398(00)01102-6]

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/122/2/172/5882445/172_1.pdf

Reference8 articles.

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3. Chen, Lih-Shan, Shen-Li, Fu, and Kwan-Dar, Huang, 1997, “Low Temperature Sinterable Multilayer Ceramic Substrates Embedded With Capacitors,” Proceedings of the Technical Program, Pan Pacific Microelectronics Symposium, Maui, HI, 28–31 Jan., pp. 271–221.

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