Detection of delaminations in sub-wavelength thick multi-layered packages from the local temporal coherence of ultrasonic signals-Reference-Cited by-同舟云学术

Detection of delaminations in sub-wavelength thick multi-layered packages from the local temporal coherence of ultrasonic signals

Published:2008-06 Issue:4 Volume:41 Page:280-291
ISSN:0963-8695
Container-title:NDT & E International
language:en
Short-container-title:NDT & E International

Author:

Martin E.,Larato C.,Clément A.,Saint-Paul M.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Condensed Matter Physics,General Materials Science

Reference12 articles.

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2. Tee TY, Hundt M, Cognetti C. Four-dimensional design optimization of system-in-package with CAE. International SEMATECH, TRC, October 2004.

3. Ultrasonic measurements of microelectronics molding compounds;Clément;J Mater Sci: Mater Electron,2002

4. Ultrasonic measurements of microelectronics resins;Martin;J Mater Sci: Mater Electron,2005

5. An interfacial delamination analysis for multichip module thin film interconnects;Hu;ASME J Electron Packag,1996

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